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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

July 10, 2020 | Nolan Johnson, PCB007

The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.

EPTE Newsletter: Monocoque Printed Circuits, Part 4

July 10, 2020 | Dominique Numakura, DKN Research

Based on past columns where Dominique Numakura explored the basic concept of monocoque printed circuits, he received many inquiries and questions about this new circuit technology. In this column, he continues to explore alternative technology in flexible circuits.

Zulki’s PCB Nuggets: Soft Electronics Pose PCB Microelectronics Assembly Challenges

July 8, 2020 | Zulki Khan, NexLogic Technologies, Inc.

Zulki Khan explains how PCBs have moved from traditional large rigid boards to considerably smaller rigid and combinations of rigid and flex circuit boards, even to the point that bare chips and wire bonding are used during the PCB microelectronics assembly of these tiny boards.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

July 3, 2020 | Andy Shaughnessy, Design007 Magazine

The USMCA trade agreement was just the tip of the iceberg in news affecting our industry this week. We also saw more young people getting involved in the industry, an HDP User Group webinar on automotive thermal issues, and more questions for our own Happy Holden—this time, on stacked microvia reliability, or the lack thereof.

IPC: Shawn DuBravac and Chris Mitchell on USMCA

July 2, 2020 | Nolan Johnson, I-Connect007

On July 1, 2020, the USMCA trade act (United States-Mexico-Canada Act) phased in as a trade agreement guiding economic trade and growth in North America. Nolan Johnson spoke with both Shawn DuBravac, IPC’s chief economist, and Chris Mitchell, IPC’s vice president of global government affairs and an I-Connect007 columnist, about the impact of USMCA on North American electronics manufacturing.


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