EPA, Industry Come Together in Visit to TTM Facility

July 18, 2019 | Kelly Scanlon, director, EHS policy and research

IPC member TTM Technologies is proud to show off the new wastewater-treatment system at its Sterling, Virginia plant, which is helping to enhance the company’s pollution prevention and resource recovery performance.

The Big Picture: Globalization—What Happened?

July 16, 2019 | Mehul Davé, Entelechy Global, Inc.

Cheap products and services from places like China and India are good, but giving up the position of being the top dog doesn't sit well with most people—especially when you have leaders around the world reminiscing about the past and wanting to make XYZ great again or something similar.

Spark an Idea

July 11, 2019 | Tara Dunn, Omni PCB

One of the favorite parts of my job are the days when I meet with a group of engineers and designers to talk about flex and rigid-flex. We might do a "lunch and learn" with a general overview of the technology or address a specific challenge. It is always helpful to bring samples to pass around and show different features. Usually, looking at a sample will spark an idea and the comment, "I wonder if we could do something like this.” From there, the brainstorming begins.

The PCB Norsemen: From Wooden Huts to Homemade Go-karts—It All Starts With Design!

July 8, 2019 | Team Elmatica, Elmatica

Whether building the coolest go-kart or the most sophisticated electronic hardware, the story is the same: It starts with design. And for designers and manufacturers, early involvement and commitment between all the involved parties in a product development process diminishes the risk for mistakes and misunderstandings.

EPTE Newsletter: JPCA Show 2019, Part 2

July 3, 2019 | Dominique Numakura, DKN Research

Many new technologies and products related to flexible circuits were introduced by mid-sized manufactures at the JPCA Show 2019. Oki Cable displayed several unique technologies that included stretchable and transparent circuits. They are proactive with introducing new materials for base materials as well as conductors and coverlay.