FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

EPTE Newsletter: Powerful Earthquake Hits Japan

February 25, 2021 | Dominique Numakura, DKN Research

After a powerful earthquake hit Japan a few weeks ago, Dominique Numakura reminisces about the devastating effects of the Great East Japan Earthquake 10 years ago. He also shares headlines of the week related to electronics.

Consider This: PCB Technologies We Need Now and Later

February 17, 2021 | John Talbot, Tramonto Circuits

RF high frequency circuits are in almost every vehicle being produced today, with side, front, and rear radar to warn of potential collisions. Specialized RF technology high frequency PCBs are in high demand.

Flexible Thinking: IC Package Footprints—Why So Many and How Many Is Enough?

February 12, 2021 | Joe Fjelstad, Verdant Electronics

Joe Fjelstad takes a historical look at the formation of integrated circuits and what that means for today's PCB designs.

EPTE Newsletter: Taiwan Releases 2020 PCB Production Numbers

February 11, 2021 | Dominique Numakura, DKN Research

The Taiwan Printed Circuit Association (TPCA) released December’s shipment data. Full year data is also posted for 2020, so it’s time to review the industry’s performance.

Orbotech Flex Equipment Introduction

February 5, 2021 | Barry Matties, I-Connect007

Barry Matties speaks with Meny Gantz about the challenges for flex manufacturing, what’s driving the complexity around it, and how Orbotech’s new products will help their customers produce flex in much more effective way.


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