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Arlon Electronic Materials President Brad Foster sits down with Nolan Johnson to discuss capital investments the company is making in business expansions and upgrades, and the important role a niche supplier plays in the North American quick-turn electronics market.
As the VP of manufacturing technology and innovation for Jabil, Dan gave us his take on the current state of flex and alternative substrates and explained why modeling, automation, and process controls are likely to be key ingredients in the recipe for manufacturing non-FR-4 boards in the future.
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.
One of the primary advantages of moving to a flexible circuit design from a rigid board is the ability to package the flex in three dimensions, bending or folding into imaginative configurations and saving precious space in the final package.
Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.
Welcome to Real Time with… IPC APEX EXPO 2019 Show & Tell by Nolan Johnson
Electronics Industry Comes Together at IPC APEX EXPO 2019 by Dr. John Mitchell
Real Time with… IPC APEX EXPO 2019 Video Showcase and Library
Happy’s Highlights by Happy Holden
Leo Lambert, IPC’s 2019 Hall of Fame Inductee by Patty Goldman
Inspiring the Next Generation of Leaders: IPC STEM Student Outreach Program by Patty Goldman
A STEM Student on FIRST Robotics and Career Opportunities by Barry Matties
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