SPOTLIGHT
This issue Got Flex? Featuring:
Expert Discussion: The Flex Technologists Speak, a conversation with Jonathan Weldon, Mark Finstad, Scott McCurdy, and Scott Miller
Expert Discussion with John Talbot, Tramonto Circuits, a conversation with John Talbot
Field Trip: CID Class Sees How Flex is Made at Streamline Circuits, by Kelly Dack
Excerpt: The Printed Circuit Designers’ Guide to Flex and Rigid-Flex Fundamentals, by Dave Lackey and Anaya Vardya
APCT Moves into Rigid-Flex with Cartel, Cirtech Acquisition, a conversation with Steve Robinson
Deadline Approaching for Abstract Submission
The deadline is fast approaching for the submission of technical paper for the electronics industry’s premier technical conferences and exhibition, or provide a course proposal for the largest educational event in...
FocalSpec Appoints Harri Leinonen as New CEO
The Board of Directors has appointed Harri Leinonen as the new chief executive officer of FocalSpec Oy. Harri, 55, has built his long and impressive career in global technology companies. He holds a Master’s degree in...
Atotech to Present New Flex, Flex-Rigid Products at C’Tex 2018
Atotech will showcase its latest production solutions for advanced HDI, flex, and flex-rigid PCBs in hall C1 booth number AN6 at the C’Tex 2018...
Atotech to Demo Spherolyte CU UF3 for Fine Line RDL at ECTC 2018
As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as...
Pioneer Circuits Displays Flex Circuits at 2018 Space Tech Expo
Looking to support emerging Space Companies with their proven flex circuit technology, Pioneer Circuits will exhibit at the 2018 Space Tech Expo in...
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Flex Talk: Something New for Everyone
May 2, 2018 | Tara Dunn, Omni PCB
Whether you are new to single- and double-sided flex, moving into rigid-flex construction, thinking of using bookbinder technology, or investigating an additive process, working with new technology can be both exciting and challenging.
All About Flex: Terms and Conditions
April 12, 2018 | Dave Becker, All Flex
An issue that is frequently addressed by many of us in the printed circuit industry, and by others in the world of contract fabrication and assembly, is dealing with the “Terms and Conditions” in a purchase agreement or contract.
ESI Targets Growing HDI Space
April 5, 2018 | Stephen Las Marias, I-Connect007
At the recent HKPCA and IPC Show 2017 in Shenzhen, China, Chris Ryder, director of product management for HDI at Electro Scientific Industries Inc. (ESI), discusses how laser-based processing is addressing the challenges in HDI development, and MSAP technology and its impact on the PCB industry.
RTW IPC APEX EXPO: Miraco Company and Services Introduction
March 29, 2018 | Real Time with...IPC
Miraco's current quality manager, William Pfingston, fills Guest Editor Steve Williams in on the company's contract manufacturing capabilities and services, including strengths in design and flex circuits. He also talks about the company's expansion and organizational changes.
Three New Mars2020 Rover Technologies: What Powers the “Body Parts” on the Mars2020 Rover?
March 15, 2018 | Thy-An Tran, Pioneer Circuits Inc.
The Mars2020 Rover Mission, designed by JPL, is the next NASA Mars Exploration Program mission that is planned to launch in 2020. Some goals of the mission include to check for past signs of life, to help prepare for manned Mars missions, and to collect soil samples and cache them on the surface for potential return to Earth by a future mission.