FEATURED ARTICLES AND COLUMNS:

Development of Flexible Hybrid Electronics

August 14, 2019 | Weifeng Liu, PhD, Flex

This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.

July was a fun, productive month for IPC on the government relations front. Most notably, IPC’s workforce development efforts were recognized at the White House in Washington and on a factory floor in Michigan. On another front, we've launched an online platform that makes it easier for our members to contact their elected officials, and we’re using it to seek more R&D funding for an important industry project.

Trouble in Your Tank: Moving Into Microvias, Part 4

August 6, 2019 | Michael Carano, RBP Chemical Technology

Copper deposit in the vias with electroless copper or alternatives, such as carbon-based direct plate processes to the vias, depends on process control, equipment design, and chemical parameters. When these are not in control, defects arise. In this installment of the column series, Mike Carano will talk about metallization for HDI blind via processing.

Manufacturing a custom product with 100+ processing steps can be tricky enough, but when you add in a highly complex set of design attributes, pour engineering resources into defining the process, and verify that it is repeatable and reliable, that comes with a certain sense of pride and satisfaction.

A Conversation With Prototron's Van Chiem

July 30, 2019 | Steve Williams, The Right Approach Consulting

Van Chiem, a process engineer with Prototron Circuits, recently spoke with Steve Williams about developing in-house flex and rigid-flex processes and capabilities at their facility in Tucson, Arizona.


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