FEATURED ARTICLES AND COLUMNS:

Kelly Dack and Tara Dunn talk about the upcoming conference "Additive Electronics: PCB Scale to IC Scale" on October 24, 2019, hosted by SMTA in San Jose, California, and why it's an important event for people to attend—especially those involved in the design process.

Decreasing Bend Radius and Improving Reliability—Part I

October 11, 2019 | Kelsey Smith, All Flex

Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend.

Flex Talk: Don’t Build Flex That Doesn’t Flex

October 10, 2019 | Tara Dunn, Omni PCB

One of the primary advantages of moving to a flexible circuit design from a rigid board is the ability to package the flex in three dimensions, bending or folding into imaginative configurations and saving precious space in the final package.

Standards: Why We Have Them and Live by Them

October 7, 2019 | Alifiya Arastu, Jeff Beauchamp, Harry Kennedy, and Ruben Contreras, NCAB GROUP

Have you ever designed a board but received feedback that it couldn’t be manufactured unless changes were made? Or maybe you’ve designed a complex board and sent it to the factory only to find out that the manufacturer didn’t build the board to your expectations? PCBs are becoming more complex, factory options are growing, and expectations for product life cycles are becoming longer.

Insulectro and DuPont Experts Talk Flex Design

September 25, 2019 | Mike Creeden, CID+, Insulectro

I recently spoke with Insulectro’s Chris Hunrath and DuPont’s Steven Bowles at the DuPont Technology and Innovation Center in Sunnyvale, California. We discussed a variety of topics related to flex design, including the support structure that’s needed in flex design, the everchanging world of flex materials, and the need for working with a flex fabricator as early as possible in the flex design cycle.


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