I-Connect007 Launches Thermal Management with Insulated Metal Substrates eBook
February 13, 2018 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is excited to announce the release of the latest title in our micro eBook design series: The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates.
The Printed Circuit Designer’s Guide to… is an ongoing book series specifically dedicated to educating PCB designers, and serves as a valuable resource for people seeking the most relevant design information available.
Considering thermal issues in the earliest stages of the design process is critical. Written by Didier Mauve, sales and marketing manager at Ventec International Group, and Ian Mayoh, technical support manager, this book highlights the need to dissipate heat from electronic devices.
The authors provide essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates. The book also aims to aid PCB designers in the selection and specification of materials for particular applications, which will contribute to more reliable and cost-effective designs.
Alun Morgan, Chairman at EIPC, describes the book as, "A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."
Readers will develop a comprehensive awareness of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies.
Download your free copy today at I-007eBooks.com/TM! You can also view our full library at I-007eBooks.com.
Look for these other exciting titles in The Printed Circuit Designer’s Guide to… series:
- Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals by American Standard Circuits
- Power Integrity and Signal Integrity by Example by Mentor, A Siemens Business
- Secrets of High-Speed PCBs — Parts 1 & 2 by Polar Instruments
- Design for Manufacturing (DFM) by Altium
…and these upcoming releases:
- Executing Complex PCBs by Freedom CAD
- Documentation by DownStream Technologies
We hope you enjoy The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com+1-916-365-1727 (GMT-8)
+1-916-365-1727 (GMT-8)
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.