Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND

04/29/2024 | Samsung Electronics
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.

Siemens Nederland, VDL Strengthen Partnership for Second-Generation Automated Guided Vehicles (AGVS)

04/24/2024 | VDL Automated Vehicles
This fall, Siemens Nederland and VDL Automated Vehicles will launch the second generation of their automated logistics platform based on Automated Guided Vehicles (AGVs) for industrial firms with mixed-traffic sites.

SCHMID Group Presents Breakthrough Solutions for Substrate Production at ISES USA

04/09/2024 | SCHMID Group
The SCHMID Group, a global leader in providing solutions to the high-tech electronics, photovoltaics, glass, and energy systems industries participated in the International Semiconductor Executive Summit (ISES) USA this week.

MKS’ Atotech, ESI to Participate in IPC APEX EXPO

03/29/2024 | MKS’ Atotech
MKS’ Atotech and ESI will participate in this year’s IPC APEX EXPO 2024, the PCB industry’s largest event in North America, to be held in Anaheim, California, to be held from April 6-11 2024 at the Anaheim California Convention Center.

ECWC16 Technical Conference Special Sessions

03/20/2024 | Julia Gumminger, IPC
The ECWC16 Technical Conference at IPC APEX EXPO 2024 will feature two curated Special Technical Sessions on Thursday, April 11. Building on the success of similar sessions last year, these sessions will feature leaders in the advanced packaging and e-mobility segments, focusing on technological challenges and innovations. Both sessions were curated by the Technical Program Committee (TPC), consisting of subject matter experts in their fields.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in