ROARTIS Introduces Fast Cure Materials for Printed Electronic Applications
June 30, 2020 | ROARTISEstimated reading time: 1 minute
Belgium based ROARTIS BV, also known under their brandnames IQ- BOND® and IQ-CAST® develops and manufactures adhesives, coatings and resins for high reliability electronic applications.
In the past few years, special attention has been given to printed electronic applications, where high throughput processes required the development of faster assembly materials.
As an example, ROARTIS has developed a range of anisotropic conductive adhesives, used in the assembly of fine pitch RFID antennas, where reliable interconnections of the RFID tab onto the RFID antenna can be realized in a matter of seconds. In view of the growing volume demands from the printed electronics industry, ROARTIS has been able to combine their ultra-fast curing chemistry with lower cost raw materials, making them attractive materials for current and future high volume projects, such as smart labels, RFID tags, wearable electronics, etc.
IQ-BOND 5976-ACE addresses the economic challenges of printed electronics, in combination with the high throughput processing requirements and long term reliability requirements. IQ-BOND 5976-ACE is designed to provide high adhesion strength on different flexible, as well as rigid substrates, such as PET, polyimide, FR4, copper, aluminum and silver. It has been tested extensively in moisture (85°C/85%RH – 1000 hrs), as well as temperature cycling (-40°C/+125°C) testing.
The material cures in a matter of seconds with thermode- or induction curing systems, enabling to assembly 20.000 – 40.000 microchips per hour on typical, industrial, flip chip production systems.
Suggested Items
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.