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Polish Industrial Partners Complete Five Major Offsets Projects

05/09/2024 | Lockheed Martin
The Ministry of Defence officially approved five completed Offset projects in the first phase of the WISLA programme. Lockheed Martin partnered with local industrial partners to increase technical capabilities and provide manufacturing know-how of components related to Patriot Advanced Capability – 3 (PAC-3) Missile Segment Enhancement (MSE) and in support of Poland’s air and missile defence.

U.S. Air Force Secretary Kendall Flies in AI-Piloted X-62A VISTA

05/06/2024 | Lockheed Martin
Lockheed Martin Skunk Works joined the U.S. Air Force Test Pilot School and other government and industry partners in hosting U.S. Secretary of the Air Force Frank Kendall to fly in the X-62A Variable In-flight Simulation Test Aircraft (VISTA), a one-of-a-kind aircraft modified to test artificial intelligence (AI) and autonomy capabilities.

Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract

04/26/2024 | Lockheed Martin
Lockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).

Lockheed Martin Successfully Transitions Long Range Discrimination Radar To The Missile Defense Agency

04/23/2024 | Lockheed Martin
The Long Range Discrimination Radar (LRDR) at Clear Space Force Station in Clear, Alaska, completed DD250 final acceptance and was officially handed over to the Missile Defense Agency in preparation for an Operational Capability Baseline (OCB) decision and final transition to the Warfighter. In addition, prior to this transition, the system has started Space Domain Awareness data collects for the United States Space Force. 

Lockheed Martin Boosts Domestic Microelectronics Capabilities for Pentagon Aerial Defense Program

04/08/2024 | Lockheed Martin
Lockheed Martin will work with Intel Corporation, and Altera, an Intel Company, to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program for the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).
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