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Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
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IPC's PCB Design for Manufacturability
December 28, 2023 | IPCEstimated reading time: 1 minute
Taught by an industry expert with more than 40 years of experience in the field, this 3-week online program, which starts Feb 20, 2024 | 12:00pm and runs through , is designed to provide the knowledge and skills necessary to reduce or eliminate design, documentation, and capability issues that often arise when completed PCB designs are sent to the fabricator for production.
Course Content
- DfM Course Introduction, Fabricator Capability and Materials
- Panelization, Stackups and Surface Finishes
- Conductive Features, Holes/Vias and Other Mechanical Features
- Masks and Inks, Impedance and Signal Loss, and Electrical Test
- FPC, Documentation and Specifications
- Participants receive the following helpful documents developed by Korf Consultancy LLC.
PCB Fabrication Design Rules
This editable document is designed to help PCB designers avoid many of the issues identified during the fabricator’s initial DFM review. It provides an extensive list of sample design rule parameters that designers can use to ensure that their designs are compatible with fabricator capabilities before the fabricator’s initial review. These globally representative design parameters are based on the most recent PCB design requirements.
Rigid PCB Fabrication Acceptance Specification
This editable document provides recommended qualification and performance specifications for all IPC-6012 requirements defined as AABUS (As Agreed Between User and Subscriber). Designers can use this document to inform fabricators of their company’s specific manufacturing, documentation, and quality requirements, inclusive of those that do not appear in IPC Standards.
Suggested Items
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.