-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 5, 2024 | Andy Shaughnessy, I-Connect007Estimated reading time: 3 minutes
Spring has definitely sprung; it was 81 degrees last week in Atlanta, and this week it’s been in the 40s. That’s typical spring weather in Atlanta. My newly cut lawn is looking great, thanks to my “yard guy” Clive.
And now our industry’s trade show season is in full swing. I’m all checked in and heading to Anaheim to cover IPC APEX EXPO next week. There’s a lot going on there this year, especially in PCB design. The number of design-related conference classes continues to grow with each show. That’s a good thing: New designers are entering the workforce, slowly but surely, and many companies are losing their subject matter experts to retirement.
IPC APEX EXPO will be held in Anaheim for the next couple of years. The last time I attended in Anaheim was about 20 years ago, and I never did make it to Disneyland. I’m shooting for some Mouse time this year.
I need to finish packing, so without further ado, here’s my must-reads for this week. I hope to see you in California.
Tim’s Takeaways: The Art of Technical Instruction
Published April 4
Speaking of PCB design, do you have what it takes to be a design instructor? You might. As columnist Tim Haas explains, there’s a need for design instructors, and if you’re constantly doing research and reading the latest white papers, you might be a great candidate for a design instructor. He also provides a few horror stories from his design teaching days. Check it out.
Creators of SMT UHDI Test Board Vehicle Discuss this Important Project
Published April 4
Chrys Shea led the development of the SMT test vehicle a few years ago. As features continued to shrink, the industry saw a need for a UHDI test vehicle, so Chrys and Altium’s David Haboud sprang into action. In this audio interview, they discuss what it took to update the test vehicle to UHDI and why technologists working in UHDI should check it out for themselves.
Global Sourcing Spotlight: Don’t Be Afraid of Global Sourcing
Published April 3
No matter how good things are going, some of us have this nagging suspicion in the back of our minds that there’s another snafu waiting around the corner, and another supply chain shutdown probably ranks Numero Uno in that category. But as columnist Bob Duke explains, despite two shooting wars and our stressful relationship with China, global sourcing is not only looking solid—it actually might help bring nations closer together and stave off potential conflicts. As he says, “Business is all about people.”
Checking In With ICAPE Group
Published April 3
ICAPE operates in countries around the globe, from China to South Africa to the U.S., so the company has a pretty broad view of the fab industry. In this interview, ICAPE’s Erik Pedersen explains how they approach sustainability, what sustainability actually entails, and why value engineering is so critical.
IPC APEX EXPO 2024: There’s an App for That
Published April 3
If you’re heading to IPC APEX EXPO, you’ve probably noticed that there are so many classes and “special events” taking place, often at the same time. Make it easy on yourself and scan this handy-dandy APEX QR code, and you’ll be able to see each day’s events at a glance while getting alerts for the events that are most important to you.
Suggested Items
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.