Real Time with...IPC 2017 Videos Now Available for Viewing


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Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers on their new products, learn more about the HDP Users Group, and don't miss the videos by IPC President John Mitchell and his staff. All available here

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35 Years of HDI Fabrication Processes and Obstacles for Implementation

12/04/2017 | Happy Holden, I-Connect007
The electronics industry is the world’s largest and most robust market. It is also a bulwark of American creativity, with Silicon Valley as its origin and fortress.

HDI’s Beneficial Influence on High-Frequency Signal Integrity

10/17/2017 | Happy Holden, I-Connect007
The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).

Embedding Active and Passive Components in Organic PCBs for More Reliability and Miniaturization

06/20/2017 | Thomas Hofmann, HOFMANN LEITERPLATTEN GMBH
Hofmann Leiterplatten GmbH has developed a wide range of products in the last 25 years. New manufacturing know-how has been developed in fabricating organic PCB with embedded devices. A special name, AML (active multilayer), was created to differentiate the surface mount devices (SMD) and the device embedded technology (DET) PCBs. Manufacturing processes that are not typical for standard PCB fabrication shops has been developed.



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