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Clark Webster discusses the increased need for high temperature, high speed materials, new developments in their assembly capabilities and the importance of working with your manufacturer for flex design.
Watch the interview here.
Andy Shaughnessy, I-Connect007
It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?
Nolan Johnson, I-Connect007
Nolan Johnson speaks with IPC’s Chris Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packaging Symposium, scheduled for October 11-12, 2022 in Washington, DC. In this conversation, Mitchell and Kelly detail the symposium's objectives, presenters, and the value to both fabricators and assemblers in attending.
Pete Starkey, I-Connect007
Faced with the choice between a real or virtual event, Bill Wilkie took a calculated risk. It has been many long months since members of the Institute of Circuit Technology had gathered together under one roof, but a fair-sized bunch of industry stalwarts braved the weather and the threat of COVID, descended on the Manor Hotel in Meriden, UK, on Nov. 30, and applauded Bill’s decision to go live. They were not disappointed; the program was superb, the atmosphere upbeat, and the networking opportunity priceless.