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The recent distribution agreement between Arlon EMD and Doosan Electro-Materials enables the supply and technical support of Doosan’s flexible laminates and high-Tg FR-4 and halogen-free materials into North America to complement Arlon’s established range of polyimide and specialty materials for the military, avionics and space market segments. Arlon vice president Brad Foster explains the opportunities and benefits.
Barry Matties, I-Connect007
At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.
Stephen Las Marias, I-Connect007
Abel Ruivo, Atotech Deputy Business Director of Electronics for Greater China, and Daniel Schmidt, head of Global Marketing for Electronics at Atotech Group, spoke with I-Connect007 about the various challenges of PCB manufacturing in China, as well as about the opportunities in the sector.
Pete Starkey, I-Connect007
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.