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Orbotech West President Sharon Cohen explains the company structure and philosophy—translating ideas into reality - and how, by understanding the issues driving PCB technology, Orbotech is able to provide the imaging and inspection tools to meet the needs of next-generation interconnection density.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
Dennis Fritz, Fritz Consulting
On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.
Stephen Las Marias, I-Connect007
In an interview with I-Connect007, Jimmy Fang, VP of business development at Sunshine Global PCB Group, speaks about the key demand drivers for the PCB industry, the challenges in the market, and the opportunities they are seeing.