A Brief Tutorial on Embedded Capacitors


Reading time ( words)

Introduction

Compunetics has been operating in the embedded components market for more than 20 years. Initially driven by their parent company’s need for high layer-count, high-density embedded capacitance cards for their OEM product offerings, technology and processes were developed which are mature and reliable. Embedded technology is integrated into PCBs using conventional processing techniques; the capacitive layers are drop-in replacements in the existing PCB stack. However, special processing is required to properly transport the extremely thin cores associated with embedded capacitance layers (three to 25 microns thick).

Embedded capacitors rely on utilization of planar copper-clad, thin-core laminate (Figure 1). These laminates replace decoupling capacitors which are normally mounted next to an IC. The IC is routed directly to the capacitive layer using vias. The laminates are drop-in replacements that use the existing PCB stack-up. Various dielectrics and core thicknesses are available. For example, DuPont HK04 material utilizes a 1-mil copper-clad polyimide core which functions as an ideal capacitor (Figure 2).


To read the full version of this article which appeared in the June 2017 issue of The PCB Magazine.

Share


Suggested Items

Cerambus Discusses the Next Generation in PCB Plating

07/12/2018 | Stephen Las Marias, I-Connect007
Cerambus Technology Inc. President John Nash sat down with I-Connect007 for a discussion on the latest developments in plating technology, challenges and opportunities in the China market, and their strategy for sustaining growth in a highly competitive industry.

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 2

07/10/2018 | Pete Starkey, I-Connect007
Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1

07/09/2018 | Pete Starkey, I-Connect007
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.



Copyright © 2018 I-Connect007. All rights reserved.