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Compunetics has been operating in the embedded components market for more than 20 years. Initially driven by their parent company’s need for high layer-count, high-density embedded capacitance cards for their OEM product offerings, technology and processes were developed which are mature and reliable. Embedded technology is integrated into PCBs using conventional processing techniques; the capacitive layers are drop-in replacements in the existing PCB stack. However, special processing is required to properly transport the extremely thin cores associated with embedded capacitance layers (three to 25 microns thick).
Embedded capacitors rely on utilization of planar copper-clad, thin-core laminate (Figure 1). These laminates replace decoupling capacitors which are normally mounted next to an IC. The IC is routed directly to the capacitive layer using vias. The laminates are drop-in replacements that use the existing PCB stack-up. Various dielectrics and core thicknesses are available. For example, DuPont HK04 material utilizes a 1-mil copper-clad polyimide core which functions as an ideal capacitor (Figure 2).
To read the full version of this article which appeared in the June 2017 issue of The PCB Magazine.
Pete Starkey, I-Connect007
“Summer is over, now it's back to work!” This was the opening line of the invitation to the 18th EIPC Technical Snapshot webinar, Sept. 14, following the theme of advances in automotive electronics technology, introduced and moderated by EIPC President Alun Morgan. The first presentation, entitled "The fully printed smart component—combining additive manufacturing and sensor printing," came from Jonas Mertin, a thin-film processing specialist at the Fraunhofer Institute for Laser Technology.
Denis Jacques, Technic Inc.
About three decades ago, immersion silver, a nitrate-based process, gained a lot of market share in the world of PCB final finishes. More economical than ENIG, flat, solderable, and conductive, it had everything going for it—everything but corrosion resistance in a harsh environment, that is. Champagne voids were also an issue, along with line reduction. But the worst drawback, the characteristic that made the part short over time, was creep corrosion. A build-up of copper sulfide salt that grows in contact with a sulfur-rich environment, heat, and moisture resulted in failures in the field. This was enough to scar the process for good.
Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.