Review of the 2017 IPC Reliability Forum


Reading time ( words)

IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.

Event Background

The event steering committee charged with developing the forum was headed by Program Chair Michael Carano, and included Don Dupriest, Michael Jawitz, Craig Hillman, Gary Ferrari, Jack Fisher, Denny Fritz, and Sanjay Huprikar, VP of the IPC Member Services. Mike Carano, VP of RPB Chemical Technologies, served as the forum’s ringleader, host and emcee. I was fortunate enough to have been asked to participate and speak at the event, and I feel an obligation to let those who were not able to attend this year know what an invaluable educational opportunity this ongoing forum presents for our industry moving forward.

The Audience

The forum was well attended, with a veritable who’s who of our industry’s supply chain, including raw material and equipment suppliers, PCB fabricators, contract manufacturers and OEMs. Companies represented included: Amphenol, Atotech, Aurora Circuits, CTS, DfR Solutions, Dow Chemical, Dow Electronic Material, DuPont–RTP, Embraer S.A., Extreme Engineering Solutions, FTG Circuits, HDP User Group International, Holaday Circuits, Intrinsiq Materials, Inventec Performance Chemicals,  IPC, KEMET Electronics, Lockheed Martin Space Systems, Lockheed Missiles and Fire Control, MacDermid Enthone, MED-EL, Minco, Motorola,  Nexteer Automotive, Northrop Grumman, NSWC Crane, NTS, Orbital, Park Electrochemical, Penn State University, Precision Analytical Laboratory, Prismview, Raytheon, RBP Chemical Technology, Rockwell Collins, RollsRoyce, SAIC, Summit Interconnect, The Right Approach Consulting, ThingWeaver Solutions, TTM Technologies, Ventec, and ZESTRON.

The Topics

The Steering Committee did a wonderful job of assembling a lineup of topics that were both relevant to the forum’s theme of manufacturing high-performance products, and presenting insight from our industry’s brightest technological minds. What follows is a brief highlight of each speaker’s presentation.

To read the full version of this article which appeared in the July 2017 issue of The PCB Magazine, click here.

Share

Print


Suggested Items

Better to Light a Candle: Chapter One—Prepping the Next Generation

01/08/2019 | Marc Carter, Independent Contributor
There has been a considerable amount of (electronic) ink and words shared in our industry bemoaning the graying-out of our industry and the growing shortage of skilled people at all levels. (See the May 2017 PCB007 Magazine column “Help Wanted—and How!” for just one example). As is usually the case, though, when all is said and done, more has been said than done.

MacDermid Enthone Discusses Consolidation Benefits

01/08/2019 | Pete Starkey, I-Connect007
At the 2018 electronica exhibition in Munich, Frando van der Pas, director of marketing and sales for MacDermid Enthone—Europe, and Technical Editor Pete Starkey discussed the consolidation benefits and the vision and future of the company.

150+ Years of Experience: Reflections with Three Industry Icons

11/20/2018 | Barry Matties, I-Connect007
You would be hard-pressed to find a more knowledgeable and experienced group than that of Gary Ferrari, Gene Weiner, and Happy Holden. In a brief interview with Barry Matties, these three industry icons consider the past, present, and future state of electronics manufacturing while also offering advice to the newest generation of manufacturers.



Copyright © 2019 I-Connect007. All rights reserved.