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IPC—Association Connecting Electronics Industries will be holding a Flexible Circuits-HDI Forum on October 17–18, 2017 in Minneapolis, Minnesota.
IPC Flexible Circuits – HDI Forum is two days of professional development offering instruction and tutorials for the electronics industry. With topics ranging from flexible circuit metallization to designing a reliable and cost-effective HDI-circuit, this event promises to provide quality education and networking opportunities. Additional topics to be discussed include how to transition customers on leading edge technology from prototype to production, as well as solderable finishes for flex boards, and rigid-flex signal integrity.
To register, click here.
Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, and Kenneth Church nSCRYPT INC.
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll-to-roll processes.
Pete Starkey, I-Connect007
This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.
Gene Weiner, Weiner International Inc.
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.