Ventec Highlights Advanced Thermal Management Solutions at Electric & Hybrid Vehicle Technology Expo

Reading time ( words)

Ventec International will showcase its extensive range of thermal management solutions at the Electric & Hybrid Vehicle Technology Expo on booth #900, including the latest advanced material for thermally conductive cores and prepregs for multi-layer and hybrid build ups. The expo will take place September 12-14, 2017 in Detroit, Michigan.

Ventec's team of materials experts will present the company's advances in high performance IMS materials that deliver an exceptional thermal performance, reliability and quality, particularly demanded by automotive and other LED lighting and DC power conversion applications.

A show-highlight will be VT-5A2, a next generation best-in-class, high Tg thin-core and prepreg material. It is designed for the world's most thermally demanding PCB applications such as power converters, hybrid multilayers and high-power electronics with heavy copper designs providing enhanced signal stability in harsh environments. With a thermal conductivity 8 times that of FR4, VT-5A2 delivers class-leading thermal performance and high flowability for perfect encapsulation, allowing for better board design for applications requiring critical thermal management in harsh environments. It is manufactured by Ventec using strict quality controlled processes that are certified to AS9100 Revision C, ISO/TS16949 and ISO 9001:2015.

Jack Pattie, President Ventec USA comments: 'As a forum for electric, hybrid and plugin hybrid vehicle technology, the Electric & Hybrid Vehicle Technology Expo will provide visitors with a unique showcase of manufacturing solutions. E-vehicles and hybrid vehicles are a huge business for us and we expect there to be a lot of interest in our solutions, particularly our new products like VT-5A2.'

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.


Suggested Items

New Year, New Equipment—Right?

02/26/2018 | Patty Goldman, I-Connect007
This month, we will discuss the equipment purchasing decision-making process. How many of you can recall the earliest “dippy dunk” PCB shops, so-called because that’s exactly how it was done? There were no conveyorized lines, no automatic hoists, no load/unload stations, maybe not even a lab for analyzing the plating baths.

EIPC’s Winter Conference in Lyon, France: Day 2 Review

02/20/2018 | Pete Starkey, I-Connect007
The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!

RTW…HKPCA & IPC Show 2017 Highlights With Canice Chung

12/08/2017 | Real Time with...HKPCA and IPC
Canice Chung, chairman of the HKPCA, speaks with Managing Editor Stephen Las Marias about the record-breaking show, held this week in Shenzhen, China.

Copyright © 2018 I-Connect007. All rights reserved.