ESA Approval for Ventec Material in Amphenol Invotec Rigid & Flex-Rigid Production

Reading time ( words)

Amphenol Invotec and Ventec International have announced that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and flex-rigid PCBs.

With high Td (395), a Tg of 250 degrees C and Low-Axis CTE (50), Ventec's VT-901 polyimide material provides the extremely high reliability performance demanded by Amphenol Invotec's space-level flex & flex-rigid PCB manufacturing process that meets ESA requirements. Amphenol Invotec's ESA approved Tamworth facility and the AS9100 accreditation of Ventec's manufacturing and distribution facilities clearly position both companies as world leaders in the supply of high-reliability aerospace PCB solutions.

Ventec manufactures all VT-901 polyimide using specially designed treaters with multiple stage filtration systems and 100% automated optical inspection (AOI) for prepreg FOD-control. The same specialist equipment is used for the production of thin-core laminates for use in the most demanding space and aerospace PCB applications.

Ventec and Invotec have formed a long-term working partnership and through mutual understanding and close cooperation are setting the standards for cleanliness of materials and finished PCBs, putting both companies in a market-leading position within the space and aerospace electronics supply chain.

Tim Tatton, Amphenol Invotec’s General Manager, said, "Amphenol Invotec and Ventec are perfectly aligned and committed to incorporate a wide range of solutions into the most demanding of applications and environments."

Mark Goodwin, Ventec COO Europe and USA, commented, "The ESA approval further demonstrates the thermal robustness of Ventec VT-901 polyimide and its suitability for use in high reliability rigid and flex rigid multi-layers in the demanding aerospace sector."

Amphenol Invotec will be exhibiting at this year’s Space Tech Expo in Germany from 24-26 October 2017 on booth F52.

About Amphenol Invotec

Amphenol Invotec manufactures a wide range of multilayer, HDI, sequential lamination, flex and rigid-flex PCBs using a variety of advanced materials, finishes and technologies to meet exacting customer specifications. We operate to the most exacting global quality standards and are accredited to: ESA, NADCAP, and AS9100 Rev C.

For more information, click here.

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.


Suggested Items

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

A Plug-in that Connects CAD Software to 3D Printer

03/13/2018 | Dan Feinberg
Nano Dimension's DragonFly 2020 Pro 3D Printer is a highly accurate and versatile inkjet deposition and curing system for printing professional multilayer circuit boards, structural electronics and antennas. In a sweeping discussion with Nano Dimension USA President Simon Fried, all my questions were answered about this innovative technology.

Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review

02/21/2018 | Pete Starkey, I-Connect007
The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.

Copyright © 2018 I-Connect007. All rights reserved.