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The National Physical Laboratory and SMART Group will hold a seminar November 9, 2017, that will showcase the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, and high temperature reliability for alternative solders and substrates materials.
Presentations include performance and lifetime of printed semiconductors, high-temperature electronics and their reliability, coatings for high temperature applications, and factors affecting moisture diffusion in PCBs.
The event will be held at the National Physical Laboratory in Hampton Road, Teddington in London.
To register, click here.
Patty Goldman, I-Connect007
MIVA Technologies is a leading equipment builder for direct imaging technologies in the circuit board and microelectronics space. The company’s head of its business development group, Brendan Hogan, sat down for an interview to provide some background and where the company’s specialties lie.
Stephen Las Marias, I-Connect007
Cerambus Technology Inc. President John Nash sat down with I-Connect007 for a discussion on the latest developments in plating technology, challenges and opportunities in the China market, and their strategy for sustaining growth in a highly competitive industry.
Pete Starkey, I-Connect007
Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.