Video from productronica 2017: DIS Improves Registration of Flex and Rigid-Flex PCBs


Reading time ( words)

From the show floor at productronica 2017, we stopped by the DIS booth for a conversation with Tony Faraci. Here, he explains how DIS has tackled the challenges of handling and alignment of flex-rigid multilayer builds (especially cut-out pre-preg layers and packing pieces) and automated what was previously an operator-dependent manual process.



Watch The Interview Here:

Click here for more coverage from productronica 2017.

Share

Print


Suggested Items

John Hendricks on 5G Materials

12/11/2018 | Pete Starkey, I-Connect007
At the 2018 electronica exhibition in Munich, John Hendricks, product marketing manager for Rogers Corporation, discussed 5G materials including demands and trends.

Technology Ambassador Alun Morgan

12/10/2018 | Barry Matties, I-Connect007
Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.

Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

12/05/2018 | Pete Starkey, I-Connect007
At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.



Copyright © 2018 I-Connect007. All rights reserved.