Reading time ( words)
Tony Mattingly, senior product manager at Rogers Corporation, discusses the company's new substrates for high-frequency/high-temperature applications.
To watch the interview, click here.
Share
PrintSuggested Items
EIPC Winter Conference, Day 1
03/19/2019 |
Alun Morgan, EIPC
EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.
Laser Focus on Flex and Rigid-flex
01/28/2019 |
Barry Matties, I-Connect007
ESI’s Chris Ryder, director of Product Management, and Shane Noel, Flex Systems product manager, discuss laser vias for flex users and the increasing necessity for companies to collaborate early on and become more and more involved, whether that be in the product design, or with the process or base material manufacturers.
Atotech at HKPCA on Announcements and Advancements
01/21/2019 |
Edy Yu, I-Connect007
Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.
