RTW IPC APEX EXPO: Rogers' High-Frequency/High-Temp Substrates

Reading time ( words)

Tony Mattingly, senior product manager at Rogers Corporation, discusses the company's new substrates for high-frequency/high-temperature applications.

To watch the interview, click here.

12/11/2018 | Pete Starkey, I-Connect007

At the 2018 electronica exhibition in Munich, John Hendricks, product marketing manager for Rogers Corporation, discussed 5G materials including demands and trends.

12/10/2018 | Barry Matties, I-Connect007

Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.

11/06/2018 | Pete Starkey, I-Connect007

The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.