Varitron Technologies Ramps Up for Commercial Printable Electronics Production


Reading time ( words)

The intelliFLEX Innovation Alliance announced today that Varitron Technologies is joining its ecosystem and making a substantial investment to develop its capabilities in flexible and hybrid electronics (FHE).

This demonstrates how Canada’s established electronics design and manufacturing industry can chart a new path for growth with FHE.

The news comes on Day 1 of CPES2018, at Centennial College’s Conference Centre in Toronto. Organized by intelliFLEX, CPES2018 is Canada’s premier conference and trade show exhibition for flexible and hybrid electronics (FHE).

Varitron is an integrated electronic manufacturing services (EMS) provider with two plants in Quebec and one in the U.S. Over the past 25 years, Varitron has carved out a select place in its market because of its manufacturing expertise and cutting-edge equipment, for clients in the energy, telecommunications, aerospace, medical, military and automotive industries. With 375 employees and more than $90 million in annual revenues, Varitron is among the top five Canadian EMS providers.

“EMS providers like Varitron—faced with stiff competition from overseas—have a substantial opportunity before them to sharpen their competitive edge and diversify their revenue base by tooling up for FHE manufacturing,” said Peter Kallai, President and CEO of intelliFLEX. “Canada has some 2,000 firms in electronics design and manufacturing that can take advantage of new additive manufacturing processes, fast prototyping tools, 3D printable electronics to print PCBs and new conductive materials that are environmentally friendly. They can also add new and unique electronics features and applications based on FHE to their toolbox.”

Over the past several years, Varitron has consulted with intelliFLEX members and other industry stakeholders to evaluate its opportunity in FHE, understand where this emerging market space is headed and determine how best to make a strategic investment.

“As part of our Destination 2020 strategy, Varitron is now moving ahead with four new advanced manufacturing initiatives, one of which is inkjet production of printable electronics,” said Patrice Lavoie, Vice-President, Sales and Business Development, at Varitron. “We see a great opportunity for expand our business in this space as clients in many of our industry verticals, such as aerospace, automotive and medical, consider how FHE solutions can meet new requirements for performance and functionality which traditional silicon cannot.”

In addition to printed electronics, Varitron’s advanced manufacturing technologies include nano protection of electronics, low pressure encapsulation of electronics, and advanced cooling for high-power and high-processing electronics.

“We look forward to working with intelliFLEX and our fellow members to overcome the challenges of manufacturing scale-up of FHE technologies and leading the charge on their mass adoption,” Lavoie added.

For more information, click here.

Share

Print


Suggested Items

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

Staying Current on Flex Manufacturing is Smart Business

04/04/2019 | Barry Matties, I-Connect007
Brendan Hogan, managing director of smart electronics manufacturer MivaTek Global, discusses how to better design for flex, and ways designers can stay current on manufacturing technology that can impact their flex boards.

TTM on Flex and Rigid-flex PCB Challenges

03/20/2019 | Barry Matties, I-Connect007
One of the biggest bareboard manufacturers in the world, TTM Technologies has seen a recent surge in flex and rigid-flex demands from their customers. In this interview, Clay Zha, Vice President of Technology Solutions of TTM’s Mobility business unit, and VP of Corporate Marketing Winnie Ng discuss the differences in manufacturing flex versus traditional PCBs, and the increasing need for rigid-flex HDI boards.



Copyright © 2019 I-Connect007. All rights reserved.