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Taiflex Scientific saw a pick-up in demand for flexible copper clad laminate (FCCL) in June, with its electronic materials business unit posting revenues of NT$780 million ($25.6 million) for the month, up by 14.8% sequentially and 30.7% on year, according to Digitimes.
The business unit generated revenues of NT$2.02 billion in the second quarter of 2018, up by 25.8% on quarter and 24.3% from a year earlier.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
E. Walch, DJ., C. Rietmann, Ph.D., and A. Angstenberger, Ph.D.
The industry is seeing ever-more stringent requirements of interconnect technologies (ICT) from die through final assembly, in particular digital and analog high frequencies, undistorted signal propagation and efficient heat propagation are concerned.
Tara Dunn, OMNI PCB
SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.