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- Proceedings for 50th Anniversary Conference Dusseldorf Available for EIPC Members
- Review Day 1, Part 2 EIPC 50th Anniversary Conference June 21–22, 2018
- Results of the 24th AT&S Annual General Meeting
- Schweizer Electronic AG
- E-Waste Offers Economic Opportunity as Well as Toxicity
- New Sales Director for UK at Ventec International Group
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Suggested Items
Bridging Knowledge and Understanding of Thermal Management Materials
03/14/2018 |
Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing
03/13/2018 |
Real Time with...IPC
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.
In Terms of Experience, a 10,000-foot View of China
01/17/2018 |
Barry Matties, I-Connect007
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.
