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In our recent survey on flex and rigid-flex circuits, majority or 76% of the respondents are currently using flex, rigid-flex and printed electronics in their manufacturing.
Of the 24% who answered no, a strong majority, 70%, are planning to use rigid-flex circuits in the future; 60% said they will use flex circuits; while 30% are also planing to use printed electronics.
To learn more about the survey, and to find out about the biggest problems when it comes to flex and rigid flex circuit design, fabrication, or assembly, check out the July issue of Flex007 Magazine.
Andy Shaughnessy, I-Connect007
At SMTA Dallas, Andy Shaughnessy stopped by the booth for The Test Connection, to find out from Bert Horner why the company has evolved into spending more time educating and consulting with their customers when it comes to testing new designs.
Nolan Johnson, I-Connect007
At the SMTA Additive Electronics TechXchange, Dr. Kourtney Wright spoke about Lockheed’s DoD work and explained why Lockheed is interested in additive. Nolan Johnson shares the highlights.
Barry Matties, I-Connect007
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.