Reading time ( words)
News from Germany
- Reducing Manufacturing Costs Through Upscaling Panel Size for Copper Plating on Fan-Out Panel-Level Packaging (FO-PLP)
- Technolam Appoints Roland Schönholz as Technical Marketing Manager
- Atotech's Surface Finish Specialist Rick Nichols a Presenter and Panelist at SMTA International 2018
Electronics Industry News
- New eBook Promotes Automation and Advanced Procedures in PCB Fabrication
- Shortages & Price Hikes Leave Supply Chain in Disarray
- Analysts Foresee Supply Chain Impact from Chip Hack Report
News from Italy
- Seica Publishes Video on New Compact Slim Next> Series
News from Spain
- Smart Systems Integration Barcelona, Spain, April 10–11, 2019
News from Switzerland
- Dyconex to Exhibit at electronica 2018 and expoAIR
News from the UK
- Ventec International Group's Martin Cotton Retires
- pOp 2: The 2nd International Conference on Photonics & Optoelectronics Packaging
- Polar October News - Limitless Drill Documentation / electronica
News from the USA
- Aegis Software and Inovaxe Partner to Deliver Integrated MES and Material Handling & Storage Solution for Ultra-Lean Manufacturing
News from WECC Members
Click here for the International Events Diary 2018
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Suggested Items
12/05/2018 |
Pete Starkey, I-Connect007
At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.
09/10/2018 |
Barry Matties, I-Connect007
At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.
03/14/2018 |
Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
