Atotech to Exhibit and Present at TPCA and IMPACT Conference


Reading time ( words)

Atotech announced its participation at this year’s TPCA Show and IMPACT Conference 2018 at the Taipei Nangang Exhibition Center in Taipei, Taiwan from October 24 to 26. The company’s booth will be prominently located at the TPCA Show floor (booth number K818) and will highlight latest solutions for (a)mSAP, mobile and 5G PCB manufacturing, among several others. Representatives from Atotech Taiwan and Atotech Group will be on-site to meet clients, prospects and partners. 

Besides the TPCA Show, Atotech is also well represented at this year's IMPACT Program with the following presentations:

On Wednesday, October 24, from 4:00 to 4:15 p.m. in Room 503, Bert Reents, global product director for electrolytic copper plating at Atotech Group, will present “Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook”. Bert will discuss the dimensions of microvias and through holes which can be filled with electrolytic copper processes today. “Copper filling technologies display clear benefits over paste plugging technologies,” states Bert. “Besides today’s more common applications, I will also highlight Atotech's status on Panel Level Packaging (PLP)."

On Thursday, October 25, from 4:00 to 4:15 p.m. in room 503, Sandra Nelle, global product manager for surface finishing at Atotech Group, will elaborate on whether or not a cyanide-free gold bath can perform adequately in a high volume manufacturing environment. “I will present a cyanide-free gold plating solution which was tested on a mid-phosphorous flex nickel bath,” says Sandra. She will establish that this eco-conscious cyanide-free gold bath is a feasible option for flexible printed circuit board manufacturing.

atotech.jpg Figure 1: Showing Atotech’s Inpulse 2THF process performing “X-plating and BMV filling” to realize a uniform bridge plating and through hole filling - a patented plating technology by Atotech

Visitors to the show are invited to attend both presentations at IMPACT Conference and stop by at booth K818 at TPCA Show, any time from October 24 to 26. Other show highlights include, Cupracid AC and PallaBond. Cupracid AC is one of Atotech’s high productivity processes specifically qualified for automotive production and a wide range of vertical conveyorized systems (VCP) as well as hoist type equipment. PallaBond is a universal final finish for maximum fine feature resolution and definition. It enhances high-frequency design and is universally applicable for high-end circuitry.

About Atotech

Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.2 billion (2017). The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs about 4,000 people in over 40 countries. For more information, click here.                       

 

Share

Print


Suggested Items

Making Materials Succeed: Past, Present, and Future Trends

05/20/2019 | Nolan Johnson, I-Connect007
Tony Senese, manager for the business development group at Panasonic EMBD, gives Nolan Johnson an overview of materials and components as well as changing business models and methods to make materials succeed and how to stay profitable.

Alun Morgan on the Future of PCB Materials

05/16/2019 | I-Connect007 Editorial Team
The I-Connect007 editorial team asked Alun Morgan, technology ambassador for Ventec International Group, to discuss materials at a high level. Our conversation delivered a detailed overview of the current state of the electronics industry.

Averatek on the Future of Additive and Semi-additive Processing

05/10/2019 | Barry Matties, I-Connect007
Averatek’s President and COO Mike Vinson talks with Barry Matties about the benefits semi-additive and additive processing can bring to the shop floor as well as some of the current challenges and limitations that continue to leave many manufacturers hesitant to implement the technology.



Copyright © 2019 I-Connect007. All rights reserved.