TTM Technologies Exhibiting at 2018 HKPCA & IPC Show


Reading time ( words)

TTM Technologies, Inc. is at the annual International Printed Circuit & APEX South China Fair (2018 HKPCA & IPC Show) at booth 1L01. The Fair is themed "Inspire the Industry. Explore the Infinity,” and runs one more day (until December 7) at the Shenzhen Convention and Exhibition Center in Shenzhen, China. As part of the exhibition, TTM Technologies has also been conducting technical seminars on topics including “PCB Technology for Advanced Driver-Assistance Systems (ADAS),” “mSAP Technology,” and “Liquid Crystal Polymer (LCP) applications for Flex.” TTM Technologies' sales and technical experts are available for product and technical on-site discussions.

“The HKPCA & IPC Show is the major PCB show of the year in Asia, and we look forward to our participation each year as it provides a great opportunity to connect with our regional customers as well as our suppliers, and to showcase our industry leading technologies,” said Kent Hardwick, TTM Technologies’ senior vice president of global sales. “As a PCB and RF components technology leader, TTM Technologies strives to engage early and collaboratively with our customers to inspire innovative solutions for the ever-advancing electronics industry.”

Be sure to stop by the TTM Technologies booth today!

Share

Print


Suggested Items

New Technical Director and Upcoming 2019 EIPC Summer Conference

05/15/2019 | Nolan Johnson and Pete Starkey, I-Connect007
Tarja Rapala-Virtanen is the newest technical director for the EIPC. I-Connect007's Nolan Johnson and long-time EIPC conference attendee Pete Starkey discuss her new role, the upcoming summer conference in Leoben, Austria, and the program in place for the June conference.

Stacked Microvia Reliability: Ongoing Work and Upcoming IPC Conference

04/24/2019 | Pete Starkey, I-Connect007
One year ago, Happy Holden's review of the 2018 IPC High-Reliability Forum reported the presentation of J.R. Strickland and Jerry Magera, who described research at MSI Applied Technology into overcoming the risk of stacked microvia failures escaping standard quality assurance procedures. Their report provided a basis for the IPC white paper IPC-WP-023, which addressed reliability issues associated with stacked microvias and included data collected from several other printed circuit manufacturers.

SEMI’s Cristina Sandoval on Mentoring and Retaining Young Talent

04/16/2019 | Nolan Johnson, I-Connect007
Cristina Sandoval, manager of workforce development and university initiatives for the SEMI Foundation, discusses how two new programs, as well as a long-running high school STEM outreach program, are aiming to address the skills gap within the industry. Sandoval also explains SEMI’s efforts to prepare students to enter the workforce and continuing to develop talent as young professionals join the industry.



Copyright © 2019 I-Connect007. All rights reserved.