Reza Meshgin Appointed Multek CEO


Reading time ( words)

Multek has named Reza Meshgin as CEO, effective December 1, 2018. In addition, Multek’s outgoing CEO, Franck Lize, has decided to move into an advisory role with DSBJ, Multek’s parent company. This will enable DSBJ to pursue new, game-changing opportunities, while ensuring a smooth transition between Reza and Franck. 

“We are fortunate to have someone of Reza Meshgin’s caliber and experience to lead Multek,” said Yuan Yonggang, chairman and president of DSBJ. “Multek will be in good hands under the steady, strategic, and proven leadership of Reza—who will continue to serve as CEO of MFLEX, Multek’s sister company specializing in flexible printed circuits. Multek’s current executive leadership team will now report to Reza as they each continue serving in their existing capacity.”

Reza has held the President and CEO role at MFLEX for over ten years. He was previously Chief Operating Officer for MFLEX since 2004, when the company successfully listed on NASDAQ. During Reza’s leadership, MFLEX achieved significant growth, substantially expanded overseas manufacturing, and was successfully acquired by strategic buyer DSBJ.  Reza’s demonstrated leadership, operational excellence, and innovative vision has guided MFLEX well over the years and will be extremely valuable in steering Multek going forward. 

“I am honored and excited to lead Multek and would like to start by thanking Franck for his great leadership in the past few years, which has transformed Multek to the great company it is today,” said Reza. “I look forward to interacting with the Multek team in the coming weeks and have no doubt that together as a team we can take the company to the next level.”

Founded in 1978, Multek currently operates a 1.6 million square feet campus in Zhuhai, China, offering one-stop engineering and manufacturing services for rigid Printed Circuit Board (PCBs), flexible printed circuits (FPC), rigid-flex, and assembly.  Multek’s plants and laboratories are equipped with state-of-the-art equipment.

Share

Print


Suggested Items

Better to Light a Candle: Chapter One—Prepping the Next Generation

01/08/2019 | Marc Carter, Independent Contributor
There has been a considerable amount of (electronic) ink and words shared in our industry bemoaning the graying-out of our industry and the growing shortage of skilled people at all levels. (See the May 2017 PCB007 Magazine column “Help Wanted—and How!” for just one example). As is usually the case, though, when all is said and done, more has been said than done.

The Shape of Things to Come: Curved, Flexible, Stretchable, and Three-Dimensional Electronics

12/27/2018 | Corné Rentrop, HOLST CENTRE
The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports).

Catching up with... HSIO Technologies President James Rathburn

11/05/2018 | Dan Beaulieu
Dan Beaulieu checked in with HSIO Technologies President James Rathburn recently to see what he and his team are up to and learned how they are using liquid crystal polymers and other materials to focus on increasing high-speed and high-density PCBs for uses in all markets.



Copyright © 2019 I-Connect007. All rights reserved.