-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Ventec International Group Receives Consent for IPO on Taiwan Stock Exchange
December 21, 2018 | Ventec International GroupEstimated reading time: Less than a minute
Ventec International Group Co. Ltd has received formal consent from the Taiwan Stock Exchange (TWSE) on its Initial Public Offer (IPO) application. The completion date is set for April 2019.
Ventec filed its final IPO application with the TWSE in October 2018 and the approval comes after a successful presentation to the Listings Review Committee at the beginning of December. The Paid-in Capital and Total Equity at the time of application for the listing was NT$ 646,143 thousand / NT$ 1,648,711 thousand. Among the conditions set by the TWSE for the approval is that Ventec release a further 10% of public shares before the completion date.
"We are proud to have received the official consent from the TWSE today and look forward to an expeditious launching of the public offer and successful listing of our shares in Taiwan," said Jason Chung, CEO. "This outstanding achievement is based on the strength and dedication of our global team and I am truly thankful for everyone's hard work that ensures Ventec’s success."
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Ventec to Launch New Bondply Dielectrics and Value-Added Services at IPC APEX EXPO 2024
03/26/2024 | Ventec International GroupVentec International Group is to reveal new products for advanced signal integrity and thermal performance, and introduce services, during IPC APEX EXPO 2024, April 9-11 on booth # 4309.
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.
MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
03/27/2024 | I-Connect007I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting.
NVIDIA GTC Focuses on Empowering Healthcare and Manufacturing with High-Performance, Low-Energy Chips
03/22/2024 | TrendForceTrendForce's analysis of NVIDIA's GPU Technology Conference (GTC) spotlights the Blackwell AI server architecture as this year's standout hardware innovation. Enhanced by the second-gen Transformer engine and fifth-gen NVLink technology, Blackwell supports AI training and real-time inference for models with up to 10 trillion parameters.