Reading time ( words)
Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.
Pattie talks about how they are helping their customers address their thermal management issues, and his outlook for the year.
To watch this interview, click here.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share
PrintSuggested Items
New High-speed 3D Surface Imaging Technology in Electronics Manufacturing Applications
10/09/2019 |
Juha Saily, Focalspec Inc.
Line confocal sensors—and scanners based on them—are used in the imaging of surfaces, transparent materials, and multi-layered structures in various metrology and inspection applications on discrete parts, assemblies, webs, and other continuous products. Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory.
Nano Dimension CEO Gives Company Update
07/19/2019 |
Nolan Johnson and Dan Feinberg, I-Connect007
Dan Feinberg and Nolan Johnson speak with Amit Dror, CEO of Nano Dimension, about recent company events and the company’s focus on high-mix/low-volume and agile local manufacturing.
ICT 45th Annual Symposium Review
06/12/2019 |
Pete Starkey, I-Connect007
The Institute of Circuit Technology (ICT) held its 45th annual symposium on June 4, 2019 in Dudley at the Black Country Museum—a symbol of the spirit of innovation in engineering technology and the entrepreneurial and manufacturing skills that had established that region’s supremacy in leading the original Industrial Revolution. Here's a recap of the events and presentations at the symposium.
