RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions


Reading time ( words)

Mark Goodwin, Ventec International Group CEO EMEA and USA, speaks with I-Connect007 Technical Editor Pete Starkey on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.

To watch the interview, click here.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

Share

Print


Suggested Items

Flexible Circuit Design Guidelines

03/05/2020 | Flexible Circuit Technologies
Flexible circuit designs share many of the same challenges of rigid PCB designs, but there are also many differences and additional challenges. The very nature of a flex circuit being able to bend and flex make it as much a mechanical device as an electrical one. This creates a special set of requirements unique to flexible circuitry. Understanding how these requirements interact will allow the PCB designer to create a flex circuit that balances the electrical and mechanical features into a reliable, cost-effective interconnect solution.

University Students Point to the Future in their Research

04/23/2019 | Nolan Johnson, I-Connect007
Cutting-edge automation, AI, machine learning, and Industry 4.0 are all part of the response to the increasing demands for printed circuit boards that are not only faster, smaller, and cheaper but also higher-frequency, lower-loss, more temperature tolerant, and higher reliability. In many cases, it will be unique and advanced research coming out of the university system that will help move the industry forward.

Flex/MSTC Joint Conference: A Collaborative Week in Monterey

03/06/2019 | Nolan Johnson, I-Connect007
Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.



Copyright © 2020 I-Connect007. All rights reserved.