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Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed on the success of the heavy gold deposition process they discussed last year. Learn how it has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.
To watch the interview, click here.
Jordan Kologe and Leslie Kim, MacDermid Alpha Electronics Solutions
As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority. Over the past year, we have seen printed circuit board manufacturers encounter challenges associated with environmental regulations, water and power outages, and pressures from the supply chain to reduce environmental footprints. From the perspective of a board fabricator, especially one that specializes in HDI, a highly resource-intensive step in the process of making a printed circuit board is the primary metallization step. All circuit boards that have multiple layers go through such a primary metallization, which is either electroless copper or direct metallization (DM).
Pete Starkey, I-Connect007
Although it was originally proposed to hold a one-day face-to-face EIPC conference in Frankfurt, travel restrictions in Germany made this impractical. But the Technical Snapshot webinar format has proved so successful that it was decided to run an extended version as an alternative—two sessions, with three presentations each. It worked extremely well. The carefully selected program on February 23 featured excellent speakers, and seamless organisation added up to an outstanding event.
Dan Beaulieu, D.B. Management Group
It’s always great to see two very good companies form a mutually beneficial alliance. I was lucky enough to watch this particular strategic partnership come to fruition this year between RBP Chemical and Schlötter. I wanted to talk to both companies, so I sat down with Matthias Hampel, global executive representative-PCB and electronics at Schlötter, and Ernest Litynski, president of RBP Chemical Technology, to get the inside story.