High-end CCL Demand from Huawei Ramping Up


Reading time ( words)

High-end copper clad laminate (CCL) demand from Huawei has been rising due to a major redesign of its 5G base station infrastructure, prompting Taiwan CCL makers to upgrade their CCL specs to meet the demand.

To wean itself off US suppliers for related IC products, Huawei has since June moved to re-design its 5G base station IC modules and cut orders for CCL for use in active antenna unit (AAU) from major US supplier Rogers while seeking alternative supply sources for such CCL.

Share

Print


Suggested Items

Avoiding CAF Failures at the IPC High-reliability Forum

07/31/2019 | Andy Shaughnessy, I-Connect007
Foresite CEO Terry Munson recently spoke with Andy Shaughnessy during the IPC High-Reliability Forum and Microvia Summit in Baltimore about his presentation on the causes of conductive anodic filament (CAF), the dangers of resin starvation, and what advice he'd give to PCB designers to avoid those types of failures.

Focusing on Surface Sensitivity for Reliability

07/26/2019 | Andy Shaughnessy, I-Connect007
At the recent IPC High-Reliability Forum and Microvia Summit, Customer Applications Scientist Elizabeth Kidd and Sales Engineer Alex Bien, both of BTG Labs, discuss with Andy Shaughnessy their presentation on the challenges of working with highly sensitive surfaces, such as the risk of contamination. They also talked about the various surface characterization techniques that BTG Labs uses to identify such contaminants.

A Guide to High-reliability PCBs from Design to Specification

07/24/2019 | Jeff Beauchamp, NCAB Group
Creating reliable PCBs is an outcome of considering all aspects that can affect reliability as early as possible in the design process. The further down the design process, the more expensive and risky it can be to fix. As they say, everything starts with the design. Because a good board design improves the reliability of the end product and lessens the risk of failure.



Copyright © 2019 I-Connect007. All rights reserved.