AT&S and Chongqing University Collaborate on Research and Education
October 7, 2019 | AT&SEstimated reading time: 2 minutes
AT&S (Chongqing) Co., Ltd and the Chongqing University have signed a framework agreement of strategic cooperation on September 26. According to the agreement, both parties will collaborate on a range of academic and educational programs including internship programs targeting different majors, designed curriculums for the IC substrates industry, talents recruitment, joint R&D projects, continuing education cooperations and joint student exchange programs between Universities in Chongqing and in Austria. It represents a milestone for AT&S as a first high-end IC substrates manufacturer in China partnering with one of the universities affiliated to the Ministry of Education of China in research and education excellence.
Chen-Jiang Phua, CEO of AT&S Business Unit Mobile Devices and Substrates, commented: “The agreement represents a win-win partnership. AT&S will be able to leverage Chongqing University’s talented students and outstanding faculty for expertise in cutting-edge technologies. Chongqing University will benefit from AT&S’s long-standing R&D capabilities and its market and commercialization expertise as of one of the world’s leading HDI PCBs and IC substrates manufactures.”
According to Phua, AT&S (Chongqing) offers training ground on site for students from Chongqing University. In September, around 80 undergraduates with the major in Engineering & Applied Chemistry spent one week with AT&S and got practical exposure from experts of the company whom enriched their knowledge in the semiconductors related manufacturing industry. It is one of the ways for AT&S to help students to begin their careers as a professional and solve the talent shortage for this fast growing key industry.
“Chongqing University combines socio-economic vision, technological capabilities, and commitment to talent development in a very creative and rather unique way, and the cooperation is a reflection of our commitment to the intellectual and human potential of this distinguished institution. We are proud to be partnering with Chongqing University to pursue scientific leadership and research excellence. Our collaboration agreement lends strong support to the notion that Chongqing will become an international logistics hub and an engine of modern industrialization”, commented Andreas Gerstenmayer, CEO of AT&S.
Chongqing is an important production bases for AT&S worldwide. In this city, AT&S has established two state-of-the-art plants for fast growing semiconductor industry and advanced HDI since 2011. In July 2019, AT&S annouced to invest a further €1 billion Euros in Chongqing over the next five years on a new manufacturing facility for high-end IC substrates.
Chongqing University was founded in 1929. It is a key national university located in Chongqing. Among its various departments, Chongqing University is especially highly ranked in the Built Environment, Engineering, Technology and Business disciplines.
Suggested Items
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
It’s Only Common Sense: OCCAM—the Time Is Now
04/22/2024 | Dan Beaulieu -- Column: It's Only Common SenseOne of my favorite books is a little tome called Who Moved My Cheese? Even those of you who don’t spend a lot of time reading books have at least heard of it and know that it refers to people, especially in business, who are so stuck in their ways that they get upset when something changes. In our business, we know this kind of thinking is especially true. In fact, it always makes me laugh when one of my innovative friends finds a new way to do something and is afraid that someone will steal his idea. I always tell him that no one in our business, especially a PCB engineer, has ever thought about someone else’s innovative idea enough to steal it.
Digitalisation and ESG
04/19/2024 | Marina Hornasek-Metzl, AT&SDigitalisation and ESG are prominent and high-priority topics in the global business community. The first focuses on applying technology throughout the value chain to produce faster, smarter, and more desirable business outcomes. The latter emphasises the broader value a business is expected to create for its stakeholders from an environmental, social, and governance perspective.