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IDTechEx is now accepting applications to present at Printed Electronics Europe in Berlin on 13−14 May 2020. Tell us about your new concepts, technologies, materials and applications. Successful submissions will be speaking alongside global experts flying in from all over the world.
From material opportunities in electric vehicles, to electronics skin patches in healthcare, to new form factors of electronics in consumer devices; these are among the topics covered at Printed Electronics Europe; the conference and exhibition of the printed and flexible electronics industry. 2,500 attendees, over 250 speakers and over 200 exhibitors will converge at the event, which focuses on the business of printed electronics—with key OEMs and value chain participants moving the industry forward.
Some of the topics we will be covering this year include:
Flexible, Hybrid & Stretchable Electronics
Flexible and Printed Batteries
Flexible Transparent Films & Barriers
Hybrid Electronic Manufacturing
Materials for Printed Electronics
Printed Electronics in Automotive
Printed Electronics in Healthcare
Printed Electronics Manufacturing
Printed Electronics in Retail
If you wish to apply to speak, please send a proposed title and short abstract by 31 January, to Chris Clare at C.Clare@IDTechEx.com or download a submission form here.
Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.
Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.
Andy Shaughnessy, Design007 Magazine
It’s been a crazy week, with lots of bad news coming out of Ukraine. (I’m a news junkie by trade, but I confess that some days I just unplug from the news completely to avoid overdosing on negativity.) And, as you might have guessed, this is all having ill effects on our electronics supply chain, which is already stretched thin. This is reflected in our IPC news item that shows an uptick in PCB sales in February, but a drop in bookings YOY, in part due to the trouble in Eastern Europe. But there’s positive news in this week’s top reads. We have a NextFlex article about an innovative flexible technology called flexible hybrid electronics (FHE) and a great interview by Dan Beaulieu. We also have a column by Travis Kelly, who discusses PCBAA’s efforts to lobby for American manufacturing in Washington. And last but not least, let’s welcome our two newest columnists, Paige Fiet and Hannah Nelson, who discuss their excitement about entering this industry.