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Amphenol Invotec is delighted to announce that Thales has awarded the business the prestigious Strategic Supplier Status after successfully completing the P-VET process. Awarding Strategic Supplier Status recognises close alignment across technical, operations, business, and service requirements.
Amphenol Invotec’s PCB capabilities are among the broadest and most advanced, delivering consistent quality and reliability for demanding systems and mission-critical applications. Amphenol Invotec has supported Thales in the UK and Europe on numerous high-profile projects over several years, across various business sectors including Naval, Avionics, Military and Space.
Terry Dowling, Sales Director at Amphenol Invotec, commented, “We are now clearly identified as strategic supplier for Thales and their EMS partners. We will engage with them on all new and upcoming projects, sharing our established ‘design for manufacture’ approach to ensure robust designs, optimum performance, value, and an accelerated time to market. We look forward to our continued relationship with Thales for the years ahead.”
Pete Starkey, I-Connect007
For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.
Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.
I-Connect007 Editorial Team
Summit Interconnect’s Gerry Partida recently spoke with the I-Connect007 Editorial Team about his research into root causes of weak microvias. Rather than a single manufacturing process cause, Gerry suggests that microvia reliability is the culmination of several material interactions and that contrary to popular belief, microvias can still be stacked in small, tight packaging densities. He highlights the need for simulation, as well as some of his findings that he plans to publish in a paper at IPC APEX EXPO 2023.