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A few months ago, we launched our “Just Ask” series with Happy Holden. Many readers took us up on it, sending all manner of questions for happy to answer.
Now, Joe Fjelstad—inventor, technologist, author, and Flex007 columnist—is getting in on the action. Here’s your chance to pick Joe’s brain. What’s the one question about this industry that you’ve always wanted to ask Joe?
Joe has spent decades working with interconnect and packaging technology, as a chemist and process engineer. He’s the pioneer behind the Occam process for solderless assembly. He often begins his columns with a quote from Lewis Carroll or Don Miguel Ruiz. Joe has also written about the need for technology companies in the Western world to develop products that help improve the lives of the poor in third-world nations.Jo
What do you want to know? Just ask Joe! If he doesn’t know the answer, he’ll talk to someone who does. To submit your questions to Joe, click here.
Joe Fjelstad is founder and CEO of Verdant Electronics and an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 185 patents issued or pending. To read past "Flexible Thinking" columns or contact Fjelstad, click here. Download your free copy of Fjelstad’s book Flexible Circuit Technology, 4th Edition, and watch the micro webinar series on flexible circuit technology.
Christopher Bonsell, Chemcut
This year, I had the great opportunity to come to IPC APEX EXPO in San Diego as a contributing member in Chemcut’s booth. Being an exhibitor is always interesting because you never know what you will learn or who you will meet. Truly, it seems that every IPC APEX EXPO is an eye-opening experience. This was the second show I attended, and last year I was amazed to see how in-depth and interconnected the electronics industry is. Seeing how many different companies contribute to manufacturing today’s core technology never fails to impress me.
Pete Starkey, I-Connect007
The IPC APEX EXPO Special Session on Advanced Packaging this year attracted enormous interest, with Conference Room 2 at capacity long before the session began. Even with lots of extra seats squeezed around the edges, the session was standing room only for the just-in-time arrivals. IPC Chief Technology Officer Matt Kelly opened proceedings by introducing a distinguished panel of experts: Jan Vardaman, president and founder of TechSearch International; Sam Salama, CEO of Hyperion Technology; Matt Neely, director of process engineering at TTM Technologies; and Jim Fuller, VP of engineering technology at Sanmina.
Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.