Flexible Circuit Technology Workshop #6: Designs, Principles, and Practices
October 13, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In less than 30 minutes, learn from flex expert Joe Fjelstad about considerations when designing flexible circuits.
Fjelstad suggests starting holistically, considering all elements of the product:
- Use “paper doll” mock-ups to expose issues early on
- Be prepared to make decisions when mechanical and electrical requirements conflict
- Learn about tolerancing, nesting, etch factors, and more
Other segments include topics such as flexible circuit designs, principles, and practices; design guidelines for bending, folding, and dynamic movement of flexible circuits; flexible circuit singulation methods; assembly aids, and more.
These 10 workshop segments, created and presented by renowned flex expert Joe Fjelstad, produced and edited by I-Connect007, and sponsored by American Standard Circuits, are a comprehensive look at flexible circuit board design, manufacturing, and assembly.
Register here to view this segment and the entire free workshop. Don’t miss what technical editor Pete Starkey calls, “An encyclopaedic series!”
Related Reading:
- Joe Fjelstad's e-Workshop Reviewed
- I-007eBook: Flexible Circuit Technology, 4th Edition
- I-007eBook: The Printed Circuit Designer's Guide to Flex and Rigid-Flex Fundamentals
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.