Ventec Strengthens Canada OEM Activities with Appointment of Sigma Component Design


Reading time ( words)

Ventec International Group Co., Ltd. has announced the appointment of Sigma Component Design (Sigma) to provide sales and support to OEM customers in Canada. The two companies have signed a contractual agreement under which Sigma will help drive new OEM business for Ventec in Canada and represent all product lines from 1st January 2021.

The Canadian market is experiencing significant growth in demand from OEM customers mainly from the ICT industries and also for automotive, medical, aerospace & defense, and other applications.

As part of Ventec's global growth strategy and to support its sales activities in Canada, Ventec has appointed Sigma due to its excellent OEM focused sales organization, local presence, market knowledge and exceptional reputation.

"Sigma Component Design will be a great asset to support and grow our existing OEM customer base in Canada. We look forward to their contribution and ability to secure new clients in the region," stated Chris Hanson, Global Head IMS Technology at Ventec.

John Grobanopoulos, President & Owner of Sigma added, "We are excited to be working in partnership with Ventec. We believe the quality and reliability of Ventec's high performance PCB base material solutions will resonate with the needs of our OEM customers in Canada. Our agreement with Ventec is synergistic with our leading market access and full range of other solutions. We look forward to helping Ventec expand their reach and working together to help bring additional value to our customers across the region."

Ventec International Group Co., Ltd. (6672 TT) is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions. 

Visit I-007eBook to download a copy of Ventec's eBook, The Printed Circuit Designer's Guide to...™ Thermal Management with Insulated Metal Substrates and be sure to check out Ventec's roundtable discussion, Use of IMS Thermal Materials in Multilayer Stackups for Power Applications.

About Ventec International Group

Ventec International Group Co., Ltd. (6672 TT) is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/08/2021 | Nolan Johnson, I-Connect007
It’s a new year, and time for new resolutions and new beginnings. “New year, new you” certainly is reflected in this past week’s news. We saw several announcements regarding mergers, acquisitions, and organizational changes, plus some government legislation to help kick off the new year. Based on viewing activity, readers were keen to keep up on the changes under way.

IPS Expanding to Accommodate Growing Market

11/24/2020 | Barry Matties, I-Connect007
I recently had the opportunity to visit IPS in their Cedar City, Utah, facility, where Mike Brask, founder and president of IPS, shared his business strategy and gave me a tour of the expanding manufacturing facility. IPS produces a wide range of PCB manufacturing equipment, including plating, DES, VCM, VRPs, ventilation, and spare parts for older equipment.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

11/20/2020 | Andy Shaughnessy, Design007 Magazine
In my top five picks, we have news about columnist Tara Dunn moving to Averatek to work with their A-SAP additive processes, and an interview with Audrey Sim regarding the “hybrid” model adopted by the HKPCA for its upcoming Electronic Circuits World Convention. We also have a compilation of the questions that readers have asked Joe Fjelstad and news about DownStream Technologies adding support for flex, rigid-flex, and embedded component designs. Finally, we share a review of some of KYZEN’s new training sessions on cleaning electronic assemblies—virtual courses that pack a lot of information into 15-minute snapshots. Knowing how tight everyone’s schedules are now, 15-minute events might be the ticket.



Copyright © 2021 I-Connect007. All rights reserved.