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Summit Interconnect recently celebrated the grand opening of its newly renovated, state-of-the-art laboratory in Anaheim, California. After three months of renovation, and nearly $250,000 of capital investment, Summit Anaheim was excited to open the doors to its pristine 900 square foot laboratory. Some of the new equipment includes:
- (2) Keyence VHX-7000 4K digital microscopes
- (1) Struers Tegramin-30 automatic micro section grinder/polisher
- (3) Allied high tech twin prep 5x micro section grinder/polishers
- Conductor Analysis Technologies OM Thermal Stress System/D-coupon tester with reflow simulation & thermal shock capabilities
Vice President & General Manager Jack Evans said, “We’re very pleased with the way the new laboratory turned out. The added space and capabilities will allow us to better serve our customers while positioning the Anaheim division for several more years of growth.”
This project was one of the first completed in Summit’s CAPEX plan for 2021. Summit is committed to a strong reinvestment plan to continuously improve the Company’s capabilities, quality, and capacity. Additional improvements will be announced throughout the year.
Summit Interconnect provides a total solution for advanced technology PCBs including rigid, flex, rigid-flex and RF designs. Summit has three manufacturing locations in the U.S. and one in Canada making it one of the largest PCB companies in North America. Summit also provides value added global sourcing through trusted supply partners. Visit our website at www.summit-pcb.com.
Pete Starkey, I-Connect007
Faced with the choice between a real or virtual event, Bill Wilkie took a calculated risk. It has been many long months since members of the Institute of Circuit Technology had gathered together under one roof, but a fair-sized bunch of industry stalwarts braved the weather and the threat of COVID, descended on the Manor Hotel in Meriden, UK, on Nov. 30, and applauded Bill’s decision to go live. They were not disappointed; the program was superb, the atmosphere upbeat, and the networking opportunity priceless.
I-Connect007 Editorial Team
"My philosophy is to rely more on sensors throughout the process to measure things non-destructively, then build a model for how you’re going to perform, and just validate against the model," said Alex Stepinski. "It’s the next step slowly happening worldwide. For instance, we’ve had 2D AOI for many years. Sometimes, this is complemented with electrical tests. Now, you start to see more 3D AOI happening. You see them putting more sensors on the AOI equipment for direct measurement. Then, you also have the traditional signal integrity testing."
Nolan Johnson, I-Connect007
Gerry Partida explains, "The industry is at a new point in evolving how we look at building boards. Our industry has historically built boards and then tried to find a test for them. Then, when they found a test for it, they figured out that it needed to be analyzed before they built the board. We did this with electrical test. We built boards and down the road, as people started asking, “Why am I buying bad boards? We should electrically test them,” electrical test was introduced, reluctantly, into the test part of manufacturing printed circuit boards by suppliers or fabricators. Then they embraced it. But when we started testing boards, we did comparison tests."