Reading time ( words)
Matrix Electronics, North America’s leading quick turn supplier for raw materials to the printed circuit market announced that the Panasonic Felios R‐F705S LCP flex product line has been expanded to now include 5 and 6 mil thick LCP materials.
Since the introduction of Panasonic’s Felios LCP materials customers and designers have been requesting thicker materials to support new RF and 5G designs requirements and to simplify the stack‐up of these part designs during fabrication. The newly available 5 and 6 mil LCP materials are available with the specialty EC low loss copper foil cladding in 9, 12, and 18µm. These materials are in stock for purchase, testing, and evaluation. Please contact Matrix customer service for additional information.
Bob Berg, Vice President of Business Development adds: “The demand for LCP flex circuit materials continues to grow to support RF and 5G designs. In addition, the chemical resistance and low moisture absorption of these LCP materials make them highly suitable for many new medical sensor and equipment applications. Matrix is delighted to be the only supplier of LCP materials in North America and like our other circuit materials the Felios LCP line is supported with a fully stocked inventory.”
Cody Stetzel, Cadence Design Systems
I have the tendency to try to replicate the delicacies I’ve ordered at restaurants in my own kitchen. One of my latest attempts at creating restaurant-worthy dishes was a Korean pancake that’s crispy on the outside but soft on the inside. With my amateur cooking skills, it proved to be an impossible task—I could either make only a hard pancake or one that was total fluff. While I’m still struggling to figure out the trick to bringing together the different textures of a Korean pancake, I’ve had more success in bringing together the hardboard elements and flexible PCB elements of a rigid-flex PCB. Compared to making Korean pancakes, striking the right balance of flexibility and rigidity on a rigid-flex PCB is easy if you abide by rigid-flex PCB design guidelines.
Nolan Johnson, I-Connect007
Key presentations from companies like Boeing highlight FLEX Conference and Exhibition 2022, held in concert with the annual SEMICON West show this week in San Francisco’s Moscone Center. SEMICON West claims to be “North America’s premier microelectronics exhibition and conference,” uniting players across the entire electronics manufacturing and design supply chain.
Sean Nachnani, NextFlex
Emerging innovations in the flexible hybrid electronics (FHE) domain are enabling new applications across multiple industries due to their highly flexible structures and additive manufacturing processes. The smaller form factor, lighter weight, and conformal capabilities are ideal for IoT edge devices in health and fitness monitoring, military asset identification and tracking, automotive displays and sensors, aerospace radar, and soft robotics. Significant industry research led by NextFlex is optimizing the processes from design through manufacture for FHE products.