Eltek Names Ron Freund as Chief Financial Officer


Reading time ( words)

Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that its Board of Directors has named Ron Freund as its Chief Financial Officer, effective January 1, 2022. Freund will succeed Mr. Alon Mualem, who resigned to pursue a business opportunity. 

Prior to joining Eltek, Freund served as the CFO of Ophir Tours Ltd. from 2015 to 2021. From 2011 to 2014, Freund served as the CFO of Middle East Tube Company Ltd., an Israeli public company, traded on the Tel Aviv Stock Exchange (TASE). In previous roles, Freund served as Deputy CEO and CFO of Soltam Systems LTD. and as a Senior Partner at Ernst & Young Israel. Freund holds a B.A. degree in Accounting and Economics from the Hebrew University, Jerusalem, and is a licensed CPA (Israel).

Eli Yaffe, CEO, commented: "The entire management team at Eltek is excited to have Mr. Freund on board and we are confident that he will be an important factor in Eltek's growth and future success. I would also like to take this opportunity to thank Alon Mualem for his contribution to our company, mainly with respect to Eltek's successful turnaround that we implemented during the last 3 years and wish him all the best in his next endeavor."

Share




Suggested Items

The Carbon Footprint of HDI: Direct Metallization vs. Electroless Copper

04/14/2022 | Jordan Kologe and Leslie Kim, MacDermid Alpha Electronics Solutions
As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority. Over the past year, we have seen printed circuit board manufacturers encounter challenges associated with environmental regulations, water and power outages, and pressures from the supply chain to reduce environmental footprints. From the perspective of a board fabricator, especially one that specializes in HDI, a highly resource-intensive step in the process of making a printed circuit board is the primary metallization step. All circuit boards that have multiple layers go through such a primary metallization, which is either electroless copper or direct metallization (DM).

Uncovering the Electronics Ecosystem

04/08/2022 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Will Marsh, vice president of TTM Technologies and president of the Printed Circuit Board Association of America, about the work the PCBAA has been doing in Washington, D.C., to get the industry better recognized by the country’s decision-makers. Marsh is optimistic, not only about the companies and individuals joining the effort, but in the recognition by Capitol Hill to secure the nation’s defense systems.

DFM 101: Edge Plating

03/18/2022 | Anaya Vardya, American Standard Circuits
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.



Copyright © 2022 I-Connect007. All rights reserved.