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FLEX Conference 2022 to Highlight Latest Flexible Hybrid Electronics Innovations
April 26, 2022 | SEMIEstimated reading time: 1 minute
FLEX Conference will gather industry experts July 11-14, 2022, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics. The event will co-locate with SEMICON West Hybrid, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain. Registration for both events is open.
Themed Electronics in Motion, FLEX Conference 2022 will focus on equipment, processes, materials and applications driving the latest flexible hybrid electronics (FHE) technology breakthroughs. The event will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.
“FLEX Conference has consistently helped turn great ideas into game-changing applications for smart transportation, buildings and infrastructure; equipment sensorization; wearable and conformable medical devices; and more,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and vice president of SEMI Technology Communities. “We are excited to co-locate FLEX with SEMICON West Hybrid to advance the integration of traditional rigid electronics with flexible electronics to improve the way the world works and lives.”
Advances in sustainability across both industries will come into focus at the Global Sustainability Summit at SEMICON West Hybrid and FLEX as flexible electronics combine new levels of processing and sensing capability with improved power usage to make the devices more eco-friendly.
FLEX Conference 2022 Breakout Sessions
- FHE Applications
- Flexible MedTech and Wearables
- Printing and Processing
- Reliability and Inspection
- Strategies and Sustainability
- Flexible Conductive Materials and Inks
- Flexible Power
- FHE Processing and Integration
The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West Hybrid 2022.
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Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.