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Atotech Japan is excited to welcome you at JPCA Show 2022, Tokyo Big Sight, from June 15 to 17. You can find our team at booth # 6B06, where we will introduce a series of new products and process solutions to the market.
Here is a short list of our show highlights:
- ViaKing® – A new direct metallization process based on graphite
- InPro® FlexFill – A new economical via filling solution for high-end flex PCBs
- V-Plate® – New vertical continuous plating equipment for copper plating
- Stanna-Flex® – New immersion tin finish for high-end flex PCBs
- Printoganth® MV TP2 – New electroless Cu process for fine line and high-frequency ICs
- InPro® SAP5 – New BMV filling in VCL systems for ICs at high current density
- InPro® CPF2 – A new electrolytic process for copper pillar plating on C4 side
- NovaBond® EX-S2 – A new ultra-low roughness bonding enhancement for IC substrates
- Uniplate® NGU – High-end PCB equipment for mSAP and amSAP applications
Event: JPCA Show 2022
Date: June 15-17, 2022
Venue: Tokyo Big Sight East Exhibition Halls
Denis Jacques, Technic Inc.
About three decades ago, immersion silver, a nitrate-based process, gained a lot of market share in the world of PCB final finishes. More economical than ENIG, flat, solderable, and conductive, it had everything going for it—everything but corrosion resistance in a harsh environment, that is. Champagne voids were also an issue, along with line reduction. But the worst drawback, the characteristic that made the part short over time, was creep corrosion. A build-up of copper sulfide salt that grows in contact with a sulfur-rich environment, heat, and moisture resulted in failures in the field. This was enough to scar the process for good.
Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.
Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.