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IPC’s Validation Services program has awarded an IPC-1791, Trusted Electronics Designer Requirements Qualified Manufacturer Listing (QML) to Fralock, located in Valencia, California.
Following the initial IPC audit, Fralock passed stringent design requirements to optimize product quality, reliability, and consistency across the entire manufacturing operation, earning a place on IPC’s global network of rigorously vetted and trusted sources.
“Fralock provides product design, development, engineering, prototyping, and manufacturing services to customers that require a high level of quality and precision,” said Shibu Gangadharan, vice president of specialty engineered materials at Fralock. “This validation assures our customers that processes pertaining to IPC-1791 are adhered to throughout the manufacturing cycle.”
IPC's Validation Services QML program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.
"Different from other audit programs, IPC's Validation Services programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Fralock on becoming members of IPC's network of trusted QML suppliers.”
Andy Shaughnessy, I-Connect007
After the initial impact of the global pandemic led to a somewhat flat 2020, Carey Burkett, vice president of Flexible Circuit Technologies, explains how the company’s growth took off in 2021, positioning it well for industry trends that continue to show great promise in medical, automotive, consumer, and more. In this interview, Carey breaks down the reasons behind the company’s recent success and how R&D, and a new Zhuhai facility, have positioned them for continued growth.
Sean Nachnani, NextFlex
Emerging innovations in the flexible hybrid electronics (FHE) domain are enabling new applications across multiple industries due to their highly flexible structures and additive manufacturing processes. The smaller form factor, lighter weight, and conformal capabilities are ideal for IoT edge devices in health and fitness monitoring, military asset identification and tracking, automotive displays and sensors, aerospace radar, and soft robotics. Significant industry research led by NextFlex is optimizing the processes from design through manufacture for FHE products.
I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. She is also co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”