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PCB Technologies is proud to announce that the company has acquired the technology and the business activity of Galil Microwaves & Microelectronics Ltd., effective as of November 1st.
The acquisition involves shifting Galil's production, expert employees, and engineering activities into PCB Technologies state-of-the-art brand new facility in Migdal Ha’emek, Israel.
Getting hold of Galil’s technology completes the full cycle of their "all-in-one" capabilities in the fabrication of PCBs, as well as the design and manufacturing of substrate, microelectronics packaging, and electronic assembly.
They welcome the team of Galil and their customers to join PCB technologies and be part of iNPACK, their miniaturization and advanced packaging division. Galil's technology will create additional synergy and add value to the all-in-one solution and bring their customers faster time to market and cost reduction for new design and production.
I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.
Nolan Johnson, I-Connect007
Nolan Johnson spoke with Brian Wojtkiewicz at PCB West about Taiyo’s latest developments in solder mask technology. They discussed the company’s advances in flexible circuits, HDI, and much more. In particular, Brian discusses the importance of reliability in fabrication and assembly. "We’re always in the fabricators’ shops. I’m out in the field talking to them, helping the operators understand the process, and making things work better because then we don’t have issues down the road," he says.
Dan Beaulieu, D.B. Management Group
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.