MKS’ Atotech to Participate in CPCA Show

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MKS Instruments announced its participation in the upcoming CPCA Show 2023, the international electronic circuits exhibition in Shanghai, China held from March 22-24, 2023. MKS will be present with representatives from two of its strategic brands, Atotech and ESI, and present its latest products and manufacturing solution for printed circuit board and package substrate manufacturing.

Product experts from overseas will be joining the local team and be available to discuss the latest industry trends and challenges, as well as introduce the new combined product offering consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service. The company will be exhibiting at booth 7T26 and this year’s product highlights include:

• V-Plate: The new gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
• InPro SAP6: The new high-end electrolyte for vertical processing of next-generation package substrates
• New Uniplate: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrates manufacturing
• Printoganth MV TP2: Next-generation electroless copper for fine-line SAP applications
• BondFilm EX: New bonding enhancement solution for low signal loss high-frequency applications
• PallaBond: Direct pure EPAG for high-end circuitry and reliability application
• CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity 
• GeodeTM: HDI PCB and package substrate high-precision CO2 via drilling tool

05/23/2023 | Barry Matties and Nolan Johnson, I-Connect007

Every industry has a beginning, and we are lucky to have Rex Rozario here to share the story of how the printed circuit board industry got its start. I-Connect007 chatted with Rex recently about how he became involved with circuit board inventor Dr. Paul Eisler.

05/17/2023 | Andy Shaughnessy, Design007 Magazine

At the SMTA Atlanta Expo and Tech Forum, I spoke with NCAB Group Field Application Engineer Ramon Roche, who gave a presentation at the show titled, “Technical Trends in the Global PCB Industry.” Ramon and I discussed his presentation, the emerging technologies that have NCAB’s focus over the next few years, and why semi-additive processes may be the key to succeeding with ultra HDI technology.

05/10/2023 | Pete Starkey, I-Connect007

It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.