An Optical Update with TTM

Reading time ( words)

Immonen: There are customers who are really looking at this for in a high-end routing, switching and in server infrastructure. That means high volumes. Obviously, supercomputing is an example of a very niche market. We want to see the potential in the high-volume markets.

Matties: When will you make this technology available in the marketplace?

Immonen: That probably will happen in a time frame of two to four years.

Matties: Why is it taking so long?

Immonen: Copper has made its way. We predicted that beyond 10 Gbps, it would be all optical, but we were wrong. We were predicting something around 16-18 Gbps, and now we're seeing 25 Gbps coming. But as the links will be shorter, the loss budget will be tighter, and the overall expense due to various chipsets needed to get clean the signals is significantly higher, customers are forced to look at other alternatives including optical.

Matties: In the world of technology, four years is an eternity. Is there something that could come and just bump this out of its place before you get it to market?

Immonen: Previously, the question was rolling around, optics vs. copper. Now it's more a question of which kind of optics will push the market first: multi-mode or single-mode, simple flex solutions or embedded optics, and at which wavelength, application or distance? We cannot put all of our fruit in one basket, so we are also developing a variety of options, including those that support the emerging silicon photonics technology which has made significant breakthroughs in recent years and has a lot of expectations.

Matties: Is this something you're going to license to others, or is this going to be an exclusive process for TTM?

Immonen: This is one option, definitely, licensing technology to others.

Matties: Well, thanks for sharing this story with us and I look forward to future updates.

Immonen: Thank you very much.


Related Presentation: Development of Optical Interconnect PCBs for High Speed Electronic Systems - Fabricator's View 



Suggested Items

The Birth of the Printed Circuit Board

05/23/2023 | Barry Matties and Nolan Johnson, I-Connect007
Every industry has a beginning, and we are lucky to have Rex Rozario here to share the story of how the printed circuit board industry got its start. I-Connect007 chatted with Rex recently about how he became involved with circuit board inventor Dr. Paul Eisler.

NCAB Advocates for Advanced Technologies

05/17/2023 | Andy Shaughnessy, Design007 Magazine
At the SMTA Atlanta Expo and Tech Forum, I spoke with NCAB Group Field Application Engineer Ramon Roche, who gave a presentation at the show titled, “Technical Trends in the Global PCB Industry.” Ramon and I discussed his presentation, the emerging technologies that have NCAB’s focus over the next few years, and why semi-additive processes may be the key to succeeding with ultra HDI technology.

EIPC Review: Ultra-high-density Interconnects, Thin-film Resistor Materials

05/10/2023 | Pete Starkey, I-Connect007
It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.