IMPACT 2015 Call for Papers is NOW OPEN!


Reading time ( words)

International Microsystems, Packaging, Assembly and Circuits Technology Conference—IMPACT 2015 calls for papers now! The IMPACT Conference is the largest gathering of packaging and PCB professionals in Taiwan, attracting over 4,000 attendees in accumulated total over the past years. Do you have any new discovery or stunning research? Submit your paper to IMPACT 2015 conference before June 15th immediately. It is truly your best access and practice to this new paradigm shift.

To reflect the stable development of flexible electronics technologies and applications. The IMPACT 2015 conference, which will be held in conjunction with TPCA Show and The 6th ICFPE (International Conference on Flexible and Printed Electronics) at Taipei Nangang Exhibition Center on October 21 - 23, 2015, is celebrating its 10th anniversary of bringing worldwide leading experts and engineers together in sharing state-of-the-art advanced microelectronic packaging and PCB technology. The IMPACT Conference is the largest gathering of packaging and PCB professionals in Taiwan, attracting over 4,000 attendees in accumulated total over the past years. As a theme reflects the cutting-edges technology development, the IMPACT Conference highlights“IMPACT on Mobile and Flexible Electronics”. This year, IMPACT Conference not only keeps collaborating with international organizations such as ICEP from Japan and iNEMI from U.S.A , but also invites foreign experts to organize the forums which will focus on IoT and Wearable technologies. We hope this conference will become a remarkable platform to show your technology research and capability.

  • Date : Oct 21 (Wed)-23(Fri), 2015
  • Venue: Taipei Nangang Exhibition Center
  • Theme: IMPACT on Mobile and Flexible Electronics
  • Exhibition: TPCA Show 2015
  • On-line Submission: www.impact.org.tw

SCOPE OF PAPER SOLICITED

IMPACT.jpg


Share



Copyright © 2017 I-Connect007. All rights reserved.