Insulectro Expands Sales Leadership to Meet Demands of Changing Marketplace


Reading time ( words)

Insulectro, a leading distributor of materials for use in the PCB and printed electronics industries, has announced promotions to the leadership of its sales division.

“2015 has been a strong year for us in both the PCB side of our business as well as our new printed electronics initiatives,” Insulectro Vice President of Sales Ken Parent commented. “It’s time to increase our focus on sales and service with two well deserved promotions.”

Effectively immediately, longtime Insulectro veterans Trey Adams and Sean Redfern become Regional Vice Presidents for the Eastern US and Western US respectively. Both Adams and Redfern will continue to report to Parent.

“Insulectro has long had a national footprint with its 10 stocking locations domestically. We learned years ago we want to be where our customers are. It makes sense that we also specialize our sales management regionally to align with our operations,” Parent continued.

Under the new plan, Trey Adams will assume responsibility for sales in Londonderry, NH; Bloomingdale, IL; Dallas, TX; and Eden Prairie, MN (Insulectro’s new location in the Twin Cities area); and Canada. Adams will also oversee sales efforts, as well, in the Pacific Northwest, an area he formerly served.

Redfern will lead the sales in Southern California, Silicon Valley, Tempe, AZ, and Aurora, CO, 

Adams has been a key player in Insulectro’s growth and success in the Midwest PCB market for over 11 years. His intimate knowledge of PCB and PE products and has great rapport with customers making him invaluable to Insulectro’s OEM strategy by successfully embracing the company’s highly-touted ACT! Initiative (a synergistic program that advancing the needs of all members of the supply chain – OEM, designer, fabricator, distributor, and supplier). 

Sean Redfern has been involved in leadership roles across most of the Redfern Companies during his 14 years, including Tri-Star Laminates (LCOA), relocating to Shanghai, China for nearly 2 years and establishing a presence in China with Tri-Star International Group (TIG), spearheading our sales and marketing efforts for Integral Technologies. For the past 1½ years Redfern has fulfilled a Regional Sales Management role for Insulectro in Southern California.  His experience will be invaluable to Insulectro’s strategic growth initiatives along with his proven track record of building strong alliances with customers and suppliers.

“I’m pleased we have two remarkably talented sales leaders in these new, important roles. As a distributor of best-in-class materials from such PCB suppliers as Isola, DuPont, LCOA, CAC, Pacothane, Ormet Circuits, and Focus Tech Chemicals, along with DuPont, Kodak, Vistana, and Coveme, and others on the Printed Electronics side, we are in the middle of rapidly changing technologies and an amazing onslaught of new, high performance materials. I know Trey and Sean look forward to meeting Insulectro’s customers throughout their territories,” Parent stated.

“This is the first of several announcements we will make in the near future – all exciting and each providing new strategies for helping our customers strengthen their businesses,” Ken Parent concluded.

About Insulectro

Insulectro is the leading supplier of PCB materials used to manufacture circuit boards as well as materials for Printed Electronics. Insulectro combines its premier product offering with local inventory in strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.

Insulectro supplies advanced engineered materials manufactured by DuPont®, Isola, LCOA®, CAC, Inc., Integral Technology, Pacothane, Vistana, and Focus Tech. These products are used by our customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military, and medical.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/02/2022 | Nolan Johnson, I-Connect007
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.

3D Electronic Devices With Additive Manufacturing

11/29/2022 | Shavi Spinzi, Nano Dimension
Imagine fabricating PCBs without the hassle of drilled vias and metal plating. Imagine PCBs with near-perfect registration. If we take it to the next stage, imagine drawing electronics in 3D space. There is a way to do all this with additively manufactured electronics (AME). We just need to start to think in 3D. This will allow us to abandon the 2D limitations that we have become so used to and expand our horizons so that we can climb to higher levels of performance. In this article, I will explore the two fundamental capabilities that are the cornerstones for drawing electronics in 3D space, which is where AME technology and 3D design capabilities converge.

Electronica 2022: Happy to Be Back in Munich

11/21/2022 | Pete Starkey, I-Connect007
As we stepped out of the hotel into the drizzling rain, we were relieved that it wasn’t snow. Looking down the escalator into the U2 platform in Munich’s Hauptbahnhof central station early on the morning of Tuesday, Nov. 15 and observing the mass of humanity pushing and shoving to cram into trains to the exhibition centre, it appeared that a significant proportion of the international electronics industry had gathered to attend electronica 2022, co-located with SEMICON Europa and recognised as the world’s leading trade fair and conference for electronics.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.